Kulicke & Soffa is the leading supplier of semiconductor interconnect equipment, materials. Solutions include wafer test, wire bonders, ball wedge bonders, dicing saws, die attach, package test, flip chip, substrates ...

Palomar Technologies provides complete process and equipment solutions for precision automated assembly of optical, radio frequency and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace and medical industries.

Tessera provides intellectual property for advanced packaging to meet the demand for smaller and faster electronic products.

MRSI Group - Worldwide capital equipment manufacturer of epoxy dispenser, eutectic bonding and die bonder systems for die attach.

We provide data storage, semiconductors and research systems markets with read/write heads, MRAM, halbach cylinders, magnetic tunnel junctions, permanent magnet assemblies for NMR, crystal growing and more. ...

Designs, manufactures and sells semiconductor assembly equipment including wire bonders, dicing saws and die. (Nasdaq: KLIC).

4 Week Lead Times for CERMET-Tipped Wedges** 4544 McGrath Street . Ventura, CA . 93003 . USA . Phone 805.644.5583. Fax 805.644.2013 ...

We manufacture wire bonders, die bonders, die attach, epoxy die attach, pull tester, and shear tester for the semiconductor industry. Levels of automation vary from completely manual to fully automatic.